Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects...
135,00 €
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement, Hardcover by Ma, Yue; Gontrand, Christian, ISBN 0367023431, ISBN-13 9780367023430, Like New Used, Free shipping in the US New insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
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