Dreidimensionale Integration von Halbleitern: Verarbeitung, Materialien und...
Three-dimensional Integration of Semiconductors : Processing, Materials, and Applications, Hardcover by Kondo, Kazuo (EDT); Takahashi, Kenji (EDT); Kada, Morihiro (EDT), ISBN 3319186744, ISBN-13 9783319186740, Like New Used, Free P&P in the UK This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. Th covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. Th concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Jetzt bei Ebay:
