3D-Integration von resistivem Schaltspeicher von Qing Luo Hardcover Buch
80,66 €
Author Qing Luo. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts:1: Associative Problems in Crossbar array and 3D architectures;.
Jetzt bei Ebay:
![Produktbild - [GOOD] China's Imperial Tombs and Mausoleums by Luo Zhewen - 1st Hardcover, DJ](https://i.ebayimg.com/thumbs/images/g/mBUAAOSw7S5mE~oa/s-l140.jpg)
